Superior Performance for Automotive Applications

The HSD interconnect system offers high-speed data transfers and secure connections in a compact size.

  • Fully shielded 100 Ω capabilities for extra protection against crosstalk

  • Mechanical keying, latching, and color coding options for easy identification

  • Trusted option for LVDS cameras, USB, and IEEE 1394 applications

  • Speed, efficiency, and size make it ideal for automotive and electronic applications

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Superior Performance

The HSD interconnect system is designed for superior performance, specifically to accommodate low-voltage differential signals. Its fully shielded 100 Ω capabilities give it extra protection against crosstalk and external influences.

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Tailored for Automotive Industry

The HSD interconnect system has mechanical keying, latching, and color coding options which meet the demands of the global automotive industry. It has become a trusted option for multiple applications in the automotive industry.

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High Speed Data Transfers

The HSD interconnect system is great at conducting high speed data transfers. It provides secure connections within its minimal size, making it an excellent choice for automotive and electronic applications.

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Shielded 100 Ω Capability

Superior Performance Design

The HSD interconnect system is specifically designed for superior performance. It is tailored to accommodate low-voltage differential signals with its fully shielded 100 Ω capability, providing extra protection against crosstalk and external influences. With specific customization options for the automotive industry, it meets the demands of the global automotive industry.

Secure High-Speed Connections

Versatile and Efficient

HSD PCB connectors are trusted for numerous applications, such as LVDS cameras, USB, and IEEE 1394. It excels in conducting high-speed data transfers while maintaining secure connections within its minimal size. This makes the HSD interconnect system an excellent choice for automotive and electronic applications due to its speed, efficiency, and size.

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